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Hot-pressed red silicone gel
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Product Description
Product Features:
Hot‑press red silicone, often referred to as hot‑press silicone sheet or red silicone pad, is a critical consumable widely used in the electronics manufacturing industry. Its primary applications are concentrated in processes that require high temperature, high pressure, and precise lamination.
Product Application:
Electronic device cushioning and sealing: As cushioning pads and sealing strips for the screen bezels, battery compartments, and interfaces of precision electronic devices—such as smartphones, tablets, and smart wearables—these components leverage their soft, resilient properties to absorb vibrations, prevent component loosening, and simultaneously block the ingress of dust and moisture, thereby ensuring stable device operation.
Based on the format you provided, here is a summary of the product applications for hot-pressed red silicone:
Product用途:
COG/FOG Bonding process: Served as a core cushioning medium, it is placed between the thermal press head and the liquid crystal display, in… COG (chip-to-glass) or FOG During the thermal pressing process for flexible printed circuit boards on glass, high temperature and high pressure are uniformly transmitted, compensating for minute gaps at the contact interface and ensuring the anisotropic conductive adhesive ( ACF ) Ensure uniform curing to prevent damage to the glass substrate.
Flexible circuit board ( FPC ) Welding: Applied to FPC In the soldering and hot‑press soldering processes, its excellent heat resistance and resilience protect delicate solder joints from mechanical damage while preventing foreign‑object‑induced crushing, thereby significantly improving soldering yield and connection reliability.
Thermal lamination of electronic components: Used for the thermal bonding of internal components in precision electronic devices such as smartphones and tablets—e.g., touch‑screen lamination and flex‑cable soldering—ensuring bubble‑free, reliable interconnections between multilayer structures and meeting the stringent tolerance requirements of high‑precision manufacturing.
Semiconductor chip packaging: Used in the thermocompression bonding process of semiconductor packaging and testing, it withstands high‑temperature operating conditions with frequent cycling, provides stable pressure buffering, and ensures reliable electrical connectivity between the chip’s leads and the substrate.
Carrier | Total thickness (Total THK) mm | Test Item (Test project) | Parameter (Typical Value) | Test Standard (Test standard) |
Hot-pressed red silicone composite film | 0.3mm～3.0mm | Density | 1.20–1.40 g/cm³ 3 | ASTM D792 |
Hot-pressed red silicone composite film | 0.3mm～3.0mm | Tensile strength Tensile Strength | ≥7.0–12.0 MPa | ASTM D2671 /GB/T 528 |
Hot-pressed red silicone composite film | 0.3mm～3.0mm | Tear strength Tear Strength | ≥20–35 kN/m | ASTM D624 /GB/T 529 |
Hot-pressed red silicone composite film | 0.3mm～3.0mm | Flame-retardant grade Flammability Rating | UL 94 V-0 | UL 94 |
Hot-pressed red silicone composite film | 0.3mm～3.0mm | Operating Temperature Range | -60～200℃ | —— |
Note:
1. The tape thickness does not include the thickness of the release liner.
2. Custom production is available upon customer request.
3. To achieve the optimal bonding surface, the substrate must be clean and dry. The ideal temperature range for applying the adhesive tape is 21–30°C. It is not recommended to bond at temperatures below 10°C, as the adhesive may harden and fail to provide a secure bond; however, the tack at low temperatures remains satisfactory.
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