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Electronic Application Tapes / Automotive Application Tapes / Electrical Application Tapes
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Product Category
Masking tape
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+86-0769-82302850
Product Description
Product Features:
Excellent adhesion, good temperature resistance, and good longitudinal and transverse tensile strength. Good holding power and no residual adhesive.
Product Structure:
It adopts high-strength, superior softness creped paper as the base material, and is coated with rubber-type pressure-sensitive adhesive on one side.
Product Applications:
Mainly used in spraying, baking, sealing, footwear, packaging, fixing, electronics, building decoration and other industries, as well as various masking and bundling purposes. High-temperature, medium-temperature, and low-temperature options are available depending on the usage environment.
| Model Type | Base Material Carrier | Standard Size Standard size | General Properties General property | |||
|---|---|---|---|---|---|---|
| Material Material | Color Color | Total Thickness (mm) Total THK(mm) | Specifications Size | 180° Peel Adhesion (N/25mm) 180°Peel adhesion(N/25mm) | Temperature Resistance Temperature resistance | |
| GL-M308 | Crepe paper | White | 0.16 | 745mm*50m | 8 | -20℃~80℃ |
| GL-M309 | Crepe paper | Buff | 0.18 | 745mm*50m | 7 | -20℃~80℃ |
| GL-M505 | Crepe paper | Buff | 0.12 | 745mm*50m | 7 | -20℃~80℃ |
| GL-M514 | Crepe paper | Buff | 0.18 | 745mm*50m | 7 | -20℃~80℃ |
| GL-M519 | Crepe paper | Buff | 0.2 | 745mm*50m | 7 | -20℃~80℃ |
| GL-M520 | Crepe paper | Buff | 0.18 | 990mm*50m | 6.5 | -20℃~80℃ |
| GL-M521 | PET+Crepe Paper PET+Crepe paper | Red | 0.2 | 1020mm*33m | 10 | -20℃~80℃ |
Remarks:
1. The adhesive thickness does not include the thickness of the release liner.
2. Customized production is available according to customer requirements.
3. For optimal adhesion, the bonding surface must be clean and dry. The optimal temperature range for tape application is 21-30℃. It is recommended that initial bonding at temperatures below 10°℃ is not suitable, as the adhesive may harden and fail to bond firmly. However, the adhesion at low temperatures is still satisfactory.
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